Tetra Semiconductors Introduces Cost-Effective, Ultra-Low Power TSR2PAM and TST2PAM Chipset for 200G and 400G Ethernet Modules

New Chipset Delivers Industry-Leading Power Efficiency and Simplified Integration for High-Speed Optical Connectivity Key Features and Benefits: Market Relevance: The TSR2PAM and TST2PAM chipsets address the strong, ongoing demand for 100G, 200G, and 400G Ethernet, which continue to dominate data center and cloud deployments. As operators seek to reduce power consumption and cost in existing […]

Tetra Semiconductors Ltd. Unveils Industry-First Multiprotocol PCI Express ICs for Next-Generation Active Optical Cables, Enabling 64 Gbit/s PAM4 and Ultra-Low-Power NRZ Data Transmission

Zürich, Switzerland – January 8, 2026 – Tetra Semiconductors Ltd., a leader in high-performance semiconductor solutions, today announced the mass-production release of its groundbreaking TSR3PAM1 and TST3PAM1 integrated circuits (ICs). These devices are the industry’s first ICs to fully support PCI Express® 6.0 specifications for Active Optical Cables (AOCs), while also maintaining backward compatibility with

Tetra Semiconductors Achieves Milestone with Industrialization of Advanced PAM4 Chipsets

Zurich, Switzerland — June 6, 2025 Tetra Semiconductors , a leader in the semiconductor industry specializing in analog integrated circuits for the optical communications sector, proudly announces a significant milestone in its journey of innovation and excellence. The company has successfully achieved the industrialization of its radiation-tolerant, linear, and re-timed 53Gbit/s PAM4 chipset, as well

Tetra Semiconductors congrats the NICT B5G BRIGHTEN project

Tetra Semiconductors congrats the NICT (The National Institute of Information and Communications Technology) B5G (Beyond 5G) BRIGHTEN project (J012368C00101, J012368C07901) for the invited paper which will be published on Journal of Lightwave Technology “An Ultra-Compact CPO Transceiver based on a 1060-nm Single-Mode VCSEL Array and Multicore Fibers” (Early access available at IEEE Explore). The NICT B5G BRIGHTEN project selected Tetra Semiconductors’ 16-channel SR

Tetra Semiconductors to extend its PAM4 technology to space

Zurich, January 24, 2022 Data traffic within satellites, launchers and space stations is constantly growing as, for example, sensors and camera resolutions increase from generation to generation. Thus, new, faster, and more efficient (in terms of energy per transmitted bit) intra-satellite data transmission is required. We are proud to announce that Tetra Semiconductors has been

Tetra Semiconductors’ analog PAM4 CDR

Zurich, October 22, 2020 Tetra Semiconductors Ltd. proudly announces their 4-channel CDR chip TSC2PAM designed to replace DSPs in existing 8-channel 400Gb Ethernet optical modules. While matching all RF performance requirements of Ethernet modules, Tetra’s new CDR offers a significantly lower power consumption and BOM costs at much smaller size than DSPs. Thus, the TSC2PAM

Tetra Semiconductors’ Sample of the New PAM4 200/400G Ethernet Transceiver Chipset Now Available

Zurich, March 5, 2020 Tetra Semiconductors Ltd., Zurich, Switzerland announces their new TS2 Transceiver Chipset for 200G/400G Ethernet SR/LR applications is now available. The chipset combines outstanding performance with minimal power consumption and offers the cost-effectiveness required to build competitive 200G/400G optical modules. Tetra Semiconductors’ transeiver chipset includes 4 Channel PAM4 VCSEL Drivers and 4 Channel PAM4 TIAs

53 Gbaud PAM4 (100G) Link Demonstrated Using an Analog CDR Technology

Zurich, November 18th, 2019 Tetra Semiconductors Is Partnering with Munich Instruments to Demonstrate a Link at 53 Gbaud PAM4 Using Tetra’s TS1 Chipset. Tetra Semiconductors Ltd., Zürich, a leading supplier of datacom and test&measurement chipsets and Munich Instruments, Munich, demonstrate the first (to our knowledge) analog CDR based (DSP-less) 53 GBaud electrical Link. The link

Tetra Semiconductors Announces Very Low Power Chipset for 200/400G Ethernet

Zurich, September 13th, 2018 Tetra Semiconductors Ltd., Zurich, Switzerland today announced the TS2 Chipset for 200G/400G Ethernet SR/LR applications. The chipset combines outstanding performance at a minimum power consumption and offers the cost-effectiveness required to build competitive 200G/400G optical modules. Tetra Semiconductors’ chipset includes a 4 Channel PAM4 VCSEL Driver, 4 Channel PAM4 TIAs as

Munich Instruments and Tetra Semiconductors introduce Cost-Efficient PAM-4 Test&Measurement Solutions

Munich, March 9th, 2018 Munich Instruments GmbH, Munich, Germany and Tetra Semiconductors Ltd., Zurich, Switzerland today announced the availability of a wide portfolio of PAM-4 T&M products, providing high-performance solutions with the cost-effectiveness required in production test environments and the development cycle of low cost PAM-4 products. Munich Instruments’ extends its product range by the

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