Tetra Semiconductors Introduces Cost-Effective, Ultra-Low Power TSR2PAM and TST2PAM Chipset for 200G and 400G Ethernet Modules

New Chipset Delivers Industry-Leading Power Efficiency and Simplified Integration for High-Speed Optical Connectivity Key Features and Benefits: Market Relevance: The TSR2PAM and TST2PAM chipsets address the strong, ongoing demand for 100G, 200G, and 400G Ethernet, which continue to dominate data center and cloud deployments. As operators seek to reduce power consumption and cost in existing […]

Tetra Semiconductors Ltd. Unveils Industry-First Multiprotocol PCI Express ICs for Next-Generation Active Optical Cables, Enabling 64 Gbit/s PAM4 and Ultra-Low-Power NRZ Data Transmission

Zürich, Switzerland – January 8, 2026 – Tetra Semiconductors Ltd., a leader in high-performance semiconductor solutions, today announced the mass-production release of its groundbreaking TSR3PAM1 and TST3PAM1 integrated circuits (ICs). These devices are the industry’s first ICs to fully support PCI Express® 6.0 specifications for Active Optical Cables (AOCs), while also maintaining backward compatibility with

Products

Tetra’s chipsets target a range of applications in the datacom, space& aerospace, consumer and T&M markets. Chipset Datacom Consumer T&M Radiation Tolerant TS0 Chipset   HDMI AOC     TS1 Chipset     PAM4 T&M   TS2 Chipset 200G/400G Ethernet     YES TS3 Chipset PCI Express Gen 5/6 AOC       TS4 Chipset

TS4 Chipset

Part Name Type Description Market Availability TSR4PAM 4 channel 106 Gbit/s PAM Receiver The TSR4PAM includes a TIA at the input to convert currents coming from a Photo Diode into a differential signal followed by a CDR Retimer with a 50 Ohm Output. The chip can operate at input bit rates of up to 106

Tetra Semiconductors Achieves Milestone with Industrialization of Advanced PAM4 Chipsets

Zurich, Switzerland — June 6, 2025 Tetra Semiconductors , a leader in the semiconductor industry specializing in analog integrated circuits for the optical communications sector, proudly announces a significant milestone in its journey of innovation and excellence. The company has successfully achieved the industrialization of its radiation-tolerant, linear, and re-timed 53Gbit/s PAM4 chipset, as well

Tetra Semiconductors congrats the NICT B5G BRIGHTEN project

Tetra Semiconductors congrats the NICT (The National Institute of Information and Communications Technology) B5G (Beyond 5G) BRIGHTEN project (J012368C00101, J012368C07901) for the invited paper which will be published on Journal of Lightwave Technology “An Ultra-Compact CPO Transceiver based on a 1060-nm Single-Mode VCSEL Array and Multicore Fibers” (Early access available at IEEE Explore). The NICT B5G BRIGHTEN project selected Tetra Semiconductors’ 16-channel SR

Tetra Semiconductors to extend its PAM4 technology to space

Zurich, January 24, 2022 Data traffic within satellites, launchers and space stations is constantly growing as, for example, sensors and camera resolutions increase from generation to generation. Thus, new, faster, and more efficient (in terms of energy per transmitted bit) intra-satellite data transmission is required. We are proud to announce that Tetra Semiconductors has been

Tetra Semiconductors’ analog PAM4 CDR

Zurich, October 22, 2020 Tetra Semiconductors Ltd. proudly announces their 4-channel CDR chip TSC2PAM designed to replace DSPs in existing 8-channel 400Gb Ethernet optical modules. While matching all RF performance requirements of Ethernet modules, Tetra’s new CDR offers a significantly lower power consumption and BOM costs at much smaller size than DSPs. Thus, the TSC2PAM

Services

We combine unique expertise into a complete offering team comprises: We offer Customer Centric Mindset A continuous customer interaction throughout the chip design phase promotes a successful andflexible usage of our standard products. Design Support Our aim is to shorten your development time always considering costs, reliability and yield of the target product. Production Support

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