This year Tetra Semiconductors turns 10 – and for the first time we have our own booth at ECOC in Málaga. Booth 1424, 21–23 September, FYCMA. Come by for a chat about low-power transceiver ICs, and a small toast to ten years of silicon-proven designs.
New Chipset Delivers Industry-Leading Power Efficiency and Simplified Integration for High-Speed Optical Connectivity Key Features and Benefits: Market Relevance: The TSR2PAM and TST2PAM chipsets address the strong, ongoing demand for 100G, 200G, and 400G Ethernet, which continue to dominate data center and cloud deployments. As operators seek to reduce power consumption and cost in existing
Zürich, Switzerland – January 8, 2026 – Tetra Semiconductors Ltd., a leader in high-performance semiconductor solutions, today announced the mass-production release of its groundbreaking TSR3PAM1 and TST3PAM1 integrated circuits (ICs). These devices are the industry’s first ICs to fully support PCI Express® 6.0 specifications for Active Optical Cables (AOCs), while also maintaining backward compatibility with
Tetra’s chipsets target a range of applications in the datacom, space& aerospace, consumer and T&M markets. Chipset Datacom Consumer T&M Radiation Tolerant TS0 Chipset HDMI AOC TS1 Chipset PAM4 T&M TS2 Chipset 200G/400G Ethernet YES TS3 Chipset PCI Express Gen 5/6 AOC TS4 Chipset
Part Name Type Description Market Availability TSR4PAM 4 channel 106 Gbit/s PAM Receiver The TSR4PAM includes a TIA at the input to convert currents coming from a Photo Diode into a differential signal followed by a CDR Retimer with a 50 Ohm Output. The chip can operate at input bit rates of up to 106
Zurich, Switzerland — June 6, 2025 Tetra Semiconductors , a leader in the semiconductor industry specializing in analog integrated circuits for the optical communications sector, proudly announces a significant milestone in its journey of innovation and excellence. The company has successfully achieved the industrialization of its radiation-tolerant, linear, and re-timed 53Gbit/s PAM4 chipset, as well
Tetra Semiconductors congrats the NICT (The National Institute of Information and Communications Technology) B5G (Beyond 5G) BRIGHTEN project (J012368C00101, J012368C07901) for the invited paper which will be published on Journal of Lightwave Technology “An Ultra-Compact CPO Transceiver based on a 1060-nm Single-Mode VCSEL Array and Multicore Fibers” (Early access available at IEEE Explore). The NICT B5G BRIGHTEN project selected Tetra Semiconductors’ 16-channel SR
Zurich, January 24, 2022 Data traffic within satellites, launchers and space stations is constantly growing as, for example, sensors and camera resolutions increase from generation to generation. Thus, new, faster, and more efficient (in terms of energy per transmitted bit) intra-satellite data transmission is required. We are proud to announce that Tetra Semiconductors has been
Zurich, October 22, 2020 Tetra Semiconductors Ltd. proudly announces their 4-channel CDR chip TSC2PAM designed to replace DSPs in existing 8-channel 400Gb Ethernet optical modules. While matching all RF performance requirements of Ethernet modules, Tetra’s new CDR offers a significantly lower power consumption and BOM costs at much smaller size than DSPs. Thus, the TSC2PAM
