TS3 Chipset

Part Name Product Type Description Market Segment Availability TSR3PAM 4 channel 32Gbit/s NRZ/PAM Receiver The TSR3PAM includes a TIA at the input to convert currents coming from a Photo Diode into a differential signal followed by a CDR Retimer with a 50 Ohm Output. The chip can operate at input bit rates of up to […]

TS0 Chipset

The demand for ultra-high-definition video, immersive gaming, and real-time content creation is driving the need for advanced connectivity solutions. The latest HDMI 2.1 and DisplayPort 2.1 standards deliver unprecedented data rates—up to 48Gbps and 80Gbps, respectively—enabling 8K resolution, high dynamic range (HDR), and seamless multi-display setups. However, achieving these performance levels in Active Optical Cables

TS2 Chipset

TS2 Chipset: Specialized for 200G and 400G Ethernet, the TS2 is optimized for short-reach applications in data centers, high-performance computing, and aerospace. It supports multiple operational modes—CDR, linear bypass, and NRZ bypass—providing flexibility for diverse system requirements. The TS2 is also available in a radiation-tolerant version, making it suitable for harsh environments such as space

TS1 Chipset

Part Name Functionality Description Application Availability TSC1ENC 14/28/56GBaud PAM4 Encoder The TSC1ENC converts two NRZ signal inputs into a single PAM4 signal of the same baud rate at the output.The chip can operate at input bit rates of 56Gbit/s, 28Gbit/s, and 14Gbit/s. Test & Measurement available TSC1DEC 14/28/56GBaud PAM4 Decoder The TSC1DEC converts a PAM4

Tetra Semiconductors’ Sample of the New PAM4 200/400G Ethernet Transceiver Chipset Now Available

Zurich, March 5, 2020 Tetra Semiconductors Ltd., Zurich, Switzerland announces their new TS2 Transceiver Chipset for 200G/400G Ethernet SR/LR applications is now available. The chipset combines outstanding performance with minimal power consumption and offers the cost-effectiveness required to build competitive 200G/400G optical modules. Tetra Semiconductors’ transeiver chipset includes 4 Channel PAM4 VCSEL Drivers and 4 Channel PAM4 TIAs

53 Gbaud PAM4 (100G) Link Demonstrated Using an Analog CDR Technology

Zurich, November 18th, 2019 Tetra Semiconductors Is Partnering with Munich Instruments to Demonstrate a Link at 53 Gbaud PAM4 Using Tetra’s TS1 Chipset. Tetra Semiconductors Ltd., Zürich, a leading supplier of datacom and test&measurement chipsets and Munich Instruments, Munich, demonstrate the first (to our knowledge) analog CDR based (DSP-less) 53 GBaud electrical Link. The link

Tetra Semiconductors Announces Very Low Power Chipset for 200/400G Ethernet

Zurich, September 13th, 2018 Tetra Semiconductors Ltd., Zurich, Switzerland today announced the TS2 Chipset for 200G/400G Ethernet SR/LR applications. The chipset combines outstanding performance at a minimum power consumption and offers the cost-effectiveness required to build competitive 200G/400G optical modules. Tetra Semiconductors’ chipset includes a 4 Channel PAM4 VCSEL Driver, 4 Channel PAM4 TIAs as

Munich Instruments and Tetra Semiconductors introduce Cost-Efficient PAM-4 Test&Measurement Solutions

Munich, March 9th, 2018 Munich Instruments GmbH, Munich, Germany and Tetra Semiconductors Ltd., Zurich, Switzerland today announced the availability of a wide portfolio of PAM-4 T&M products, providing high-performance solutions with the cost-effectiveness required in production test environments and the development cycle of low cost PAM-4 products. Munich Instruments’ extends its product range by the

Contact

Tetra Semiconductors Ltd.Rämistrasse 288001 Zürich, Switzerland+41 44 558 53 93

Team

Jörg Wieland, Chairman 35+ years of semiconductor leadership asChairman, CEO, and GM, building profitablebusinesses and leading global operations. Former ETH Zürich researcher with expertise in product engineering, ISO systems, and pioneering optical interconnects. Denis Müller, Product Manager 20+ years in global business and projectleadership, delivering reliable solutionsworldwide. Expert in mixed-signal ICs,electro-optical integration, and supply chainoptimization.

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