New Chipset Delivers Industry-Leading Power Efficiency and Simplified Integration for High-Speed Optical Connectivity
Zurich, January 20, 2026 – Tetra Semiconductors, a leader in high-performance semiconductor solutions, today announced the volume availability of its TSR2PAM (Transimpedance Amplifier) and TST2PAM (VCSEL Driver) chipset. Designed for 100G, 200G, and 400G optical modules, this chipset offers a highly efficient, cost-down solution with industry-leading power savings, making it ideal for data centers, AI infrastructure, and high-speed networking applications. The chips will be available for mass production starting February 2026.
Key Features and Benefits:
- PAM Mode: The TSR2PAM and TST2PAM chipset integrates a low-power PAM4 CDR with the optical front-ends, enabling power-efficient, low-latency recovery of PAM4 signals.
- Ultra-Low Power NRZ Mode: The TSR2PAM and TST2PAM chipset delivers a factor of 2 improvement in power efficiency compared to competitor solutions in NRZ mode, reducing power consumption to as low as 10 pJ per bit in bypass mode. This makes it one of the most power-efficient solutions available for high-speed optical modules.
- Standalone Analog Mode: The chipset’s unique standalone analog mode enables fully autonomous operation, simplifying integration and reducing overall system complexity. This allows users to design and manufacture 100G, 200G, and 400G Ethernet optical modules at a significantly lower cost compared to competing solutions.
- Advanced Equalization and Monitoring: The chips incorporate CTLE and DFE equalization, input signal strength and quality monitoring, and adaptive equalization, ensuring robust performance in real-world conditions.
- Multiprotocol Support: Thanks to support for multiple transmission protocols, the same optical module design can be used across a wide range of applications. This flexibility simplifies customer supply chains, improves inventory efficiency, and lowers overall system costs.
Market Relevance:
The TSR2PAM and TST2PAM chipsets address the strong, ongoing demand for 100G, 200G, and 400G Ethernet, which continue to dominate data center and cloud deployments. As operators seek to reduce power consumption and cost in existing optical modules, these chipsets enable more efficient, lower-cost designs without requiring major platform changes, delivering immediate value within established Ethernet ecosystems.
Quotes:
“Our TSR2PAM and TST2PAM chipset is designed to address the critical need for extremely power-efficient, cost-effective solutions in today’s high-speed optical networks,” said Martin Bossard, CEO at Tetra Semiconductors. “By delivering a factor of 2 improvement in power efficiency and simplified integration, we are enabling our customers to strengthen their 100G, 200G and 400G Ethernet modules with confidence and ease.”
Availability:
The TSR2PAM and TST2PAM chipset is available for volume orders starting February 2026. For more information, including datasheets, samples, and pricing, please visit www.tetra-semi.com or contact info@tetra-semi.com.
About Tetra Semiconductors:
Tetra Semiconductors is a leading innovator in semiconductor solutions, specializing in high-performance chips for optical networking, data centers, and AI applications. With a focus on power efficiency and cost-effectiveness, Tetra Semiconductors empowers customers to build the networks of the future.
Media Contact:
Denis Müller
Head of Marketing, Tetra Semiconductors Ltd.
📧 info@tetra-semi.com
📞 +41 44 558 53 93