Tetra Semiconductors’ Very Low Power Chipset for 100G Ethernet

Zurich, November 15, 2019

Tetra Semiconductors Ltd., Zurich, Switzerland presents the TS3 Chipset for 100G Ethernet applications. The chipset combines outstanding performance at a minimum power consumption and offers the cost-effectiveness required to build competitive 100G AOCs and optical modules.

Tetra Semiconductors’ chipset includes a 4 Channel VCSEL Driver TST3NRZ and 4 Channel TIA TSR3NRZ, both running at up to 28 Gbit/s suitable for 100G Ethernet/Infiniband solutions. The chipset enables QSFP28 AOC designs with best in class power consumption of <1.5 W for 100G Ethernet.

The chips include a “legacy” mode allowing for bypassing the CDR increasing the range of applications to lower bitrates as well as consumer electronics (HDMI AOC). 

Both chips integrate the CDR with the optical front-ends onto a single chip resulting in the best possible power and cost saving while still keeping the footprint the smallest in the market. “This is yet another proof of the agility of Tetra. We are moving at an incredible pace to complete the portfolio of excellent pmd chips for Datacom “, said Jörg Wieland, Chairman and Founder. “We believe that this chipset is the key to moving the 100G market to the next stage. For Tetra it is the first mass product launched.”

Features included on the chips are:

TST3NRZ:
  • 4 channel
  • CDR integrated
  • CTLE at the input
  • Various Monitoring functions
  • I2C type interface
  • Dimensions 1970×1345 um
TSR3NRZ:
  • 4 channel
  • CDR integrated
  • CTLE at the input
  • 3.0mA saturation current capable
  • Various Monitoring functions
  • I2C type interface
  • Dimensions 1970×1345 um

Both chips are available in production quantities as bumped and wire bond versions immediately. The Tetra team is available to assist with reference designs and on-site support to reduce the time to market.

For further information please visit www.tetra-semi.com or get in touch with us via email: info@tetra-semi.com.